I'm interested in flip chip packaging. Could someone explain what it is and how it works? I'd like to understand the basics of this technology and its applications in electronics packaging.
6 answers
Riccardo
Wed Nov 06 2024
The substrate serves as an intermediary between the die and the PCB.
Bianca
Wed Nov 06 2024
On the underside of the substrate, a Ball Grid Array (BGA) may be present.
CryptoPioneer
Wed Nov 06 2024
Flip chip packages are a type of electronic packaging technology.
amelia_doe_explorer
Wed Nov 06 2024
They involve placing a silicon die directly onto a substrate.
GalaxyWhisper
Wed Nov 06 2024
The BGA allows for connections to be made between the die and the PCB.